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luminum Cover Sheet & Wood Fiber &Phenolic Back-up BoardBack-up Board

luminum Cover Sheet & Wood Fiber &Phenolic Back-up BoardBack-up Board

Productprocess flowTDSMSDSID:
Tin PLate on Copper BusBar

Tin PLate on Copper BusBar

Enhances conductivity , prevents corrosion and improve solderability . Involve surface preparation, acid activation, tin plating, post treatment .

Productprocess flowTDSMSDSID:Tin PLate on Copper BusBar
Hardware Plating

Hardware Plating

Hardware plating is a process that enhances the durability, corrosion resistance, and aesthetic appeal of metal components through various plating techniques.

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Silver plating

Silver plating

Silver plating services have gained popularity in the lead frame industry as well as in LED applications where silver’s optical reflectivity is utilized. Silver is anti-microbial and has been used in the medical, consumer, and water treatment industries for these natural germicidal properties.

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Zinc alloy plating

Zinc alloy plating

Zinc alloy is a metal primarily composed of zinc, combined with small amounts of other metals like aluminum, copper, and magnesium to enhance strength, durability, and castability.

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Zinc Trivalent Chromate Plating

Zinc Trivalent Chromate Plating

Trivalent zinc chromate is an eco-friendly alternative to traditional hexavalent zinc chromate, offering superior corrosion protection and compliance with environmental regulations.

Productprocess flowTDSMSDSID:TCP-970/TCP-971
Alum passivation

Alum passivation

Aluminum passivation is a process that enhances the corrosion resistance of aluminum by creating a protective oxide layer on its surface. This layer, known as a passive film, prevents further oxidation and corrosion, making aluminum more durable and reliable in various applications

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Air‑source heating and cooling equipment

Air‑source heating and cooling equipment

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Plating Lines

Plating Lines

Plating Lines

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PCB Inspection Machine

PCB Inspection Machine

PCB Inspection Machine

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Connector Plating

Connector Plating

Connector plating is a critical engineering process that deposits thin metallic layers onto connector contacts to enhance conductivity, prevent corrosion, and increase durability.

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