ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

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Tin PLate on Copper BusBar

Enhances conductivity , prevents corrosion and improve solderability . Involve surface preparation, acid activation, tin plating, post treatment .

Nickel Tin on Copper

Hardware Plating

Hardware plating is a process that enhances the durability, corrosion resistance, and aesthetic appeal of metal components through various plating techniques.

Gold plating

Silver plating

Zinc alloy plating

Zinc alloy is a metal primarily composed of zinc, combined with small amounts of other metals like aluminum, copper, and magnesium to enhance strength, durability, and castability.

Wire Cutting

Zinc Trivalent Chromate

Trivalent zinc chromate is an eco-friendly alternative to traditional hexavalent zinc chromate, offering superior corrosion protection and compliance with environmental regulations.

Alum passivation

Aluminum passivation is a process that enhances the corrosion resistance of aluminum by creating a protective oxide layer on its surface. This layer, known as a passive film, prevents further oxidation and corrosion, making aluminum more durable and reliable in various applications

Connector Plating

Connector plating is a critical engineering process that deposits thin metallic layers onto connector contacts to enhance conductivity, prevent corrosion, and increase durability.

Zinc Passivation

Zinc passivation is a chemical treatment applied to zinc-coated metals to enhance corrosion resistance by forming a protective, inert layer on the surface. Zinc passivation, also known as chromate or conversion coating, is a process that creates a thin, protective layer on zinc or zinc-alloy surfaces. This layer chemically reacts with the zinc to form a zinc-chromium complex, which acts as a barrier against moisture, oxygen, and salts, preventing the formation of white rust (zinc hydroxide) and extending the li...

Lead Frame Plating

Lead frames are used in semiconductor packaging as the metal skeleton that supports the chip (die) and provides electrical connections to the outside world. Lead They are the internal frame of many chip packages. They hold the silicon die in place and connect it to external pins or leads. They are essential in IC packages like DIP, QFP, SOIC, and QFN, enabling mechanical stability, signal transmission, and thermal management. Leadframe plating is the process of coating semiconductor leadframes with metal...

Chrome Passivation

Chrome passivation is a chemical treatment that converts the surface of zinc or stainless steel into a corrosion-resistant chromate layer, enhancing durability and appearance.

IC leads plating

IC lead frame and lead plating is a core surface finishing process in semiconductor packaging. Functional metal coatings are electroplated onto the metallic leads of integrated circuits to improve solderability, resist oxidation and corrosion, strengthen wire bonding performance, and optimize electrical and thermal conductivity, Copper alloy lead frames (C194, C7025, etc.); Typical plating layers: pre-nickel strike, microporous nickel, bright tin, matte tin, tin-bismuth alloy, palladium-nickel, gold, silve...