Phosphate Acid Copper Plating
Phosphoric acid copper plating is a mild acidic copper electroplating process that uses phosphoric acid-based electrolyte and low-phosphorus copper anodes. Unlike traditional sulfuric acid acid copper, it features low corrosivity, ultra-smooth leveling ability and excellent coating ductility. It is a high-precision base plating process widely used for precision hardware, PCB components and multi-layer decorative plating systems.
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Hard Copper Chloride-free
Acid copper chloride is a specialized acidic electroplating process using chloride-based copper electrolyte. Different from sulfuric acid and phosphoric acid copper plating, it adopts copper chloride and hydrochloric acid system, featuring ultra-high throwing power, excellent deep-hole plating ability and fine grain deposition. It is a professional functional copper plating process specially designed for complex, deep-hole, threaded and low-current-area precision metal parts.
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Chemical Polish for Copper
Copper chemical polishing is a non-mechanical surface treatment process that uses specialized acidic chemical solutions to micro-etch, level and brighten copper and copper-alloy surfaces. Without grinding, buffing or physical abrasion, it removes micro scratches, oxidation layers, tool marks and surface unevenness to produce a uniform ultra-bright, smooth pure copper finish. It is widely used as pre-plating pretreatment and final decorative finishing for copper components
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