ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

Tin PLate on Copper BusBar

Enhances conductivity , prevents corrosion and improve solderability . Involve surface preparation, acid activation, tin plating, post treatment .

Nickel Tin on Copper

Cleaning & Passivation of Alum

Aluminum rapidly forms a thin, inert native aluminum oxide layer upon exposure to air. Copper tends to oxidize, develop tarnish, and generate copper‑containing corrosion residues. When both metals co‑exist on one part, galvanic corrosion risk arises during wet chemical processing. Improper cleaning leaves oils, cutting fluids, fingerprints, oxide films and inter‑metallic smuts.

Copper-Alum Composite Material

Copper-aluminum composite material is a laminated bimetallic material where pure copper and aluminum alloy are tightly bonded at the atomic level via metallurgical composite processes. It is not merely laminated or glued together, and a stable diffusion layer forms at the bonding interface, preventing delamination during bending, stamping and heat treatment.