Connector Plating
Connector plating is a critical engineering process that deposits thin metallic layers onto connector contacts to enhance conductivity, prevent corrosion, and increase durability.
Productprocess flowTDSMSDSID：
Lead Frame Plating
Lead frames are used in semiconductor packaging as the metal skeleton that supports the chip (die) and provides electrical connections to the outside world. Lead They are the internal frame of many chip packages. They hold the silicon die in place and connect it to external pins or leads. They are essential in IC packages like DIP, QFP, SOIC, and QFN, enabling mechanical stability, signal transmission, and thermal management. Leadframe plating is the process of coating semiconductor leadframes with metal...
Productprocess flowTDSMSDSID：
IC leads plating
IC lead frame and lead plating is a core surface finishing process in semiconductor packaging. Functional metal coatings are electroplated onto the metallic leads of integrated circuits to improve solderability, resist oxidation and corrosion, strengthen wire bonding performance, and optimize electrical and thermal conductivity, Copper alloy lead frames (C194, C7025, etc.); Typical plating layers: pre-nickel strike, microporous nickel, bright tin, matte tin, tin-bismuth alloy, palladium-nickel, gold, silve...
Productprocess flowTDSMSDSID：
Wire Plating
Wire plating refers to a continuous electroplating process for metal wires. Using long metal wires such as copper, brass and stainless steel wire as substrates, a uniform metal coating is electrolytically deposited on the wire surface during high-speed continuous wire feeding. This process adopts a continuous roll-to-roll electroplating production line.
Productprocess flowTDSMSDSID：
LED plating
LED plating, full name LED lead frame/stencil plating, is a core surface finishing process for LED packaging.
Productprocess flowTDSMSDSID：