Connector Plating
Connector plating is a critical engineering process that deposits thin metallic layers onto connector contacts to enhance conductivity, prevent corrosion, and increase durability.
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Lead Frame Plating
Lead frames are manufactured by removing material from a flat plate of copper, copper-alloy, or iron-nickel alloy like alloy 42. Two processes used for this are etching (suitable for high density of leads), or stamping (suitable for low density of leads) They are essential in IC packages like DIP, QFP, SOIC, and QFN, enabling mechanical stability, signal transmission, and thermal management.
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IC leads plating
IC lead frame and lead plating is a core surface finishing process in semiconductor packaging. Functional metal coatings are electroplated onto the metallic leads of integrated circuits to improve solderability, resist oxidation and corrosion, strengthen wire bonding performance, and optimize electrical and thermal conductivity, Copper alloy lead frames (C194, C7025, etc.); Typical plating layers: pre-nickel strike, microporous nickel, bright tin, matte tin, tin-bismuth alloy, palladium-nickel, gold, silve...
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Wire Plating
Wire plating refers to a continuous electroplating process for metal wires. Using long metal wires such as copper, brass and stainless steel wire as substrates, a uniform metal coating is electrolytically deposited on the wire surface during high-speed continuous wire feeding. This process adopts a continuous roll-to-roll electroplating production line.
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LED plating
LED plating is a specialized precision electroplating process designed for LED lead frames, chip substrates and SMD LED components. It deposits multi-layer ultra-thin metal coatings (copper, nickel, silver) to achieve high reflectivity, excellent solderability, stable electrical conductivity and long-term anti-tarnish performance. It is a critical micro-electroplating technology for LED lighting and display packaging.
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