
Silver plating
Silver plating services have gained popularity in the lead frame industry as well as in LED applications where silver’s optical reflectivity is utilized. Silver is anti-microbial and has been used in the medical, consumer, and water treatment industries for these natural germicidal properties.
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Silver has extremely high electrical and thermal conductivity – better than that of gold – which has solidified its use in high current power transmission and lower current power connector applications. Silver also is an excellent high temperature lubricant and can be utilized for various high temperature anti-galling applications within the bearing or fastener industries.
The use of a nickel underplate prior to silver plating copper can improve the performance of the overall deposit in several ways.
•Diffusion barrier: When silver is plated on copper a natural solid-state diffusion of the copper into the silver will occur over time. The rate of diffusion is accelerated greatly at elevated temperatures. As copper diffuses into silver it forms a hybrid copper/silver eutectic layer which negatively affects adhesion, solderability and electrical performance. Nickel forms an effective diffusion barrier to prevent this copper/silver migration from occurring. This intermediate layer of nickel is highly recommended in most specifications and even required in some such as ASTM B700 (Section 6.3.4) and QQ-S-365 (Section 3.3.5).



