stage 1: Precision Pre-Cleaning & Degreasing Remove stamping oil, dust and surface contaminants on LED lead frames by alkaline soaking and electrolytic cleaning. Ensure zero residue for flawless micro-coating adhesion.
Stage 2: Acid Activation Use mild dry acid salt or dilute acid solution to remove surface oxidation and passivation film, fully activating the metal substrate without damaging tiny precision pins.
Stage 3: Alkaline Copper Base Plating Deposit a thin, uniform alkaline copper layer as the base layer. This layer improves surface flatness, enhances subsequent layer bonding and strengthens electrical conductivity.
Stage 4: Barrier Nickel Plating Plate compact nickel barrier layer to prevent metal ion migration, block substrate diffusion and improve high-temperature resistance during LED packaging and soldering.
Stage 5: High-Reflection Bright Silver Plating (Key Step) Deposit ultra-bright, high-purity silver coating. This layer provides ultra-high light reflectivity, low contact resistance and excellent solderability for LED light emission efficiency.
Stage 6: Anti-Tarnish Passivation & Sealing Special anti-tarnish treatment protects the silver surface from oxidation, discoloration and sulfide corrosion, maintaining stable reflectivity for long service life.
Stage 7: Final Rinsing & Hot Air Drying Full overflow rinsing removes chemical residues, followed by low-temperature drying to avoid micro-water spots on tiny LED components.
