IC leads plating
IC lead frame and lead plating is a core surface finishing process in semiconductor packaging. Functional metal coatings are electroplated onto the metallic leads of integrated circuits to improve solderability, resist oxidation and corrosion, strengthen wire bonding performance, and optimize electrical and thermal conductivity, Copper alloy lead frames (C194, C7025, etc.); Typical plating layers: pre-nickel strike, microporous nickel, bright tin, matte tin, tin-bismuth alloy, palladium-nickel, gold, silve...
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Electroplating on IC external leads (lead frame external pin plating) is compatible with all package leads including DIP, SOP, QFP, QFN, BGA and power devices.
It involves depositing metal layers onto semi-conductor substrates to ensure proper electrical connectivity and durability .
The primary methods used are electroplating ad=nd electroless plating
The mainstream substrates are
1. Copper Alloy and
2. Lead frames (C194, Alloy42 iron-nickel alloy).
There are two major process routes: full lead plating after molding, and pre-plating of lead frames (selective partial plating).
