ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

Lead Frame Plating

Lead frames are manufactured by removing material from a flat plate of copper, copper-alloy, or iron-nickel alloy like alloy 42. Two processes used for this are etching (suitable for high density of leads), or stamping (suitable for low density of leads) They are essential in IC packages like DIP, QFP, SOIC, and QFN, enabling mechanical stability, signal transmission, and thermal management. Leadframe plating is the process of coating semiconductor leadframes with metals like nickel, palladium, gold, silver,...