Wire Plating
Wire plating refers to a continuous electroplating process for metal wires. Using long metal wires such as copper, brass and stainless steel wire as substrates, a uniform metal coating is electrolytically deposited on the wire surface during high-speed continuous wire feeding. This process adopts a continuous roll-to-roll electroplating production line.
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Wire plating is a precision surface finishing process that deposits a thin layer of metallic material onto the surface of conductive wires, bonding wires, leadframe pins and electronic contact wires. It is widely applied in semiconductor packaging, electronic assembly and power component manufacturing.
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Anti-oxidation & Anti-corrosion: Isolate the base metal from air and moisture to prevent surface tarnish and rust.
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Enhanced Electrical Performance: Reduce contact resistance and improve high-frequency signal transmission stability.
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Assembly Compatibility: Enable reliable wire bonding, soldering and crimping for IC packaging and circuit connection.
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Mechanical Protection: Improve surface hardness and wear resistance for long-term service stability.
