Hard Copper Chloride-free
Acid copper chloride is a specialized acidic electroplating process using chloride-based copper electrolyte. Different from sulfuric acid and phosphoric acid copper plating, it adopts copper chloride and hydrochloric acid system, featuring ultra-high throwing power, excellent deep-hole plating ability and fine grain deposition. It is a professional functional copper plating process specially designed for complex, deep-hole, threaded and low-current-area precision metal parts.
Productprocess flowTDSMSDSID：Product Details
process flow
TDS
MSDS
Standard Bath Formulation
Copper Chloride (CuCl₂) – Main Copper Source Provides stable divalent copper ions for continuous and uniform metal deposition, ensuring sufficient copper supply for thick and uniform coating on complex workpieces.
Hydrochloric Acid (HCl) – Acid Medium Maintains strong solution conductivity and stable acidity, dissolves copper oxide effectively, prevents salt precipitation, and enhances solution penetration performance.
Chloride Ion Conductive Salt Improves current efficiency and uniform current distribution, significantly boosting throwing power for recessed holes, gaps and inner threads.
Special Brightening & Leveling Additives Refines copper crystal structure, eliminates rough coating, and produces smooth, ductile bright copper layer even in low-current hidden areas.
Wetting & Stabilizing Agents Prevents pinholes and air accumulation in deep holes, stabilizes solution composition and extends bath service life in mass production.
Core Functions & Key Features
Superior Deep-Hole & Recess Plating Ability The chloride system has ultra-strong penetration and throwing power. It can form uniform copper coating on deep holes, inner walls, threads and hidden corners that ordinary acid copper cannot cover.
Fine & Dense Coating Structure Produces fine-grain, smooth and non-porous copper layer with good ductility, no burrs or rough surfaces, providing high-quality base for subsequent plating.
Strong Current Uniformity Works stably under high and low current density, avoiding edge burning and thin coating in low-current areas, ensuring full-workpiece thickness consistency.
Excellent Interlayer Adhesion The copper layer bonds tightly with steel, iron and alloy substrates. It supports subsequent nickel, chrome and passivation treatment without peeling or blistering.
High Solution Stability Low sludge generation, easy maintenance and strong anti-impurity ability, suitable for long-term automated continuous production.
