ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

Standard Bath Formulation
Copper Ionic Source High-purity copper salt provides stable copper ions for uniform deposition, ensuring consistent coating thickness in mass production.
Phosphoric Acid (H₃PO₄) Base Serves as the main acidic carrier, offering mild etching ability, stabilizing solution pH value and reducing substrate over-corrosion compared with strong sulfuric acid systems.
Phosphorized Copper Anode (0.04–0.06% Phosphorus) Special low-phosphorus copper anode forms a uniform protective black film during electrolysis. It prevents excessive copper dissolution, reduces sludge generation and stabilizes bath composition for long-term operation.
Brightening & Leveling Additives Organic composite additives refine copper grain structure, fill micro surface defects and produce ultra-flat, ductile bright copper coating with excellent covering power.
Wetting & Stabilizing Agents Eliminate pinholes and air traps on complex workpieces, improve current distribution uniformity and extend plating solution service life.

 Core Functions & Key Features
Mild & Low-Corrosion Plating Phosphoric acid system has gentle chemical activity, suitable for precision and thin workpieces that cannot withstand strong acid corrosion, protecting original substrate tolerance.
Superior Surface Leveling & Smoothness Delivers ultra-flat, fine-grain copper layers that effectively cover micro scratches, tool marks and uneven textures, creating a perfect base for subsequent nickel and chrome plating.
High Ductility & Strong Adhesion The flexible copper coating does not crack or peel during bending, stamping and assembly, providing reliable interlayer bonding for multi-layer plating structures.
Low Sludge & Stable Bath Performance Matching phosphorized copper anodes minimize insoluble sludge formation, reducing solution contamination and lowering daily maintenance costs.
Excellent Throwing Power Uniform current penetration ensures consistent coating thickness on flat surfaces, curved edges, gaps and tiny structural details.