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Silver Stripper

Silver stripper is a specialized chemical solution designed to selectively dissolve silver plating from base substrates such as nickel, copper, brass or aluminum composites, while minimizing attack on underlying metal layers. It is widely used for rework, part‑reclamation, bad‑plating stripping and rack metal removal within electronic component plating lines.

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Typical Formulation (Industrial Non‑Cyanide Type, mainstream for RoHS‑compliant operations)
  1. Primary silver‑complexing agent: Nitrite‑based salts or thiourea; forms stable soluble silver complexes to drive silver dissolution without rapid etching of base metals. Thiourea‑formulated strippers are common for mild‑process stripping.
  1. Oxidizer: Ferric salt or hydrogen peroxide. Provides oxidation potential to convert metallic Ag⁰ into soluble silver ions, enabling metal dissolving. Peroxide grades require stabilizers to prevent premature decomposition.
  1. Acid medium: Sulfuric acid or phosphoric acid. Maintains low‑pH working environment, supports oxidizer activity and suppresses unwanted base‑metal corrosion.
  1. Corrosion inhibitors: Organic heterocyclic additives. Critical to protect nickel, copper or aluminum substrates from under‑etching, pitting and galvanic attack during silver stripping.
  1. Wetting agents: Low‑foam surfactants. Improve surface wetting on complex geometry parts, eliminate trapped gas pockets and ensure uniform stripping across holes and crevices

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