ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

The processes involves co-deposition , where a thin layer of nickel is plated alongside the nickel deposit as it forms. This results in a nickel layer that is typically 0.5 to 1micron thick with a surface density exceed 30,000 pores per sqm. The microporous structure distributes the corrosive action across thousand of minuscule i=sites , acting as controlled galvanic cells that prevent chromium from depositing completely thus prevent visible pitting or blistering and extending the life of the plated surface