ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

Core Formulation Composition
Organic Adsorption Agents High-molecular organic compounds that form a thin, protective adsorption film on metal surfaces. This film blocks excess acid contact and reduces metal dissolution rate effectively.
Surface Active Penetrants Improve the uniform distribution of inhibitor molecules on flat surfaces, gaps and micro-pores, ensuring full coverage and consistent protection for complex-shaped workpieces.
Stabilizing Compounds Maintain the stability of acid solution activity, resist temperature changes and long-term bath circulation, and prevent inhibitor failure in mass production environments.
Synergistic Corrosion Suppressors Auxiliary ingredients enhance anti-corrosion performance for copper, iron, steel and alloy substrates, adapting to different strong acid and weak acid working systems.

 Core Functions
Prevent Substrate Over-Etching Effectively slows down excessive acid corrosion on metal surfaces during pickling, activation and chemical polishing. It avoids metal thinning, surface pitting and dimensional tolerance deviation.
Retain Complete Metal Surface Structure Protects the original smooth metal crystal structure, prevents rough surface and edge erosion, and ensures flat and uniform base surface for subsequent plating.
Ensure Stable Acid Solution Performance Reduces metal ion dissolution into the acid bath, slowing down solution aging and contamination. It extends acid liquid service life and lowers production cost.
Improve Plating Yield & Quality Avoids plating defects caused by acid over-corrosion, such as uneven coating, poor adhesion, foggy surface and micro-pinholes.
Safe & Mild Acid Treatment Allows high-efficiency acid cleaning and oxidation removal while protecting precision thin parts and micro-components from damage