ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) are the mainstream lead-free chemical surface finishing processes for high-end PCBs and precision electronic modules. Both feature flat plating layers, no wire pull issues, compatibility with fine-pitch packaging and excellent storage stability. They make up for the drawbacks of traditional HASL and OSP processes, and are widely adopted in consumer electronics, automotive industrial control, 5G communications, precision chip packaging and other fields.
The Immersion Tin process relies on copper-tin displacement chemical reactions, requiring no power supply or anodes. It deposits a dense pure tin layer uniformly on bare copper pads, through-hole inner walls and side leads of PCBs. The plating boasts fine and uniform microscopic grains with controllable growth of copper-tin intermetallic compounds. Compatible with multiple processes including SMT reflow soldering, wave soldering and crimp terminals, it is extensively applied to mid-to-high-end products such as automotive electronics, industrial power supplies, communication modules, high-density HDI boards and QFN packaging substrates. As a mainstream surface finishing solution balancing cost performance and soldering reliability, it serves as an economical alternative to OSP, HASL and ENIG.