Product Details
process flow
TDS
MSDS
PCB Inner Layer Surface Treatment :
LDD process prior to laser drilling, pre-treatment for inner layer dry film, horizontal brown oxidation process before inner layer lamination, low microetch high-frequency high-speed brown oxidation process; non-damaging brown oxidation process.
PCB Outer Layer Surface Treatment:
Pre-treatment for outer layer dry film, super roughening process before outer layer solder mask.
Stripping solution, defoamer, flash etching chemicals for IC substrate.
